DOE-NEUP: Digital Twins for 4D Spatiotemporal Prediction of Advanced Reactors (Lead PI), 2026-2029.
DOE-AMMTO: Novel Refractory Metal Compact Heat Exchangers with Embedded Sensors for use in Harsh Service Environments (Co-PI), 2024-2027.
NSF-TTP: Transforming Energy Harvesting and Cooling: Breaking Performance and Cost Barriers of Thermoelectric Technology via High-Throughput Printing, (Single PI), 2026-2029.